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GDU 90 20301
GDU 90-20301
Gate Drive Unit
Replaces March 1998 version, DS4562-4.1 DS4562-5.0 January 2000
This datasheet should be used in conjunction with the application note AN4571, GDU9X-XXXXX Series, Gate Drive Unit.
APPLICATIONS
s Used with Gate Turn-Off Thyristors in high current switching applications
KEY PARAMETERS
IFGM IG(ON) dIGQ/dt 40A 8A 40A/s
CONDITIONS - (UNLESS STATED OTHERWISE)
V1 = +5V Test circuit GTO GDU connection to GTO Test circuit emitter and gate drive emitter Test circuit emitter current Test circuit receiver and gate drive receiver V2 = +15V DG758BX 500mm CO - AX cable type RC5327230 Hewlett Packard versatile link HFBR 1524 30mA Hewlett Packard versatile link HFBR 2524 V3 = -15V
ELECTRICAL CHARACTERISTICS
Symbol IV1 IV2 IV3 V1(Min) V2(Min) V3(Min) IFGM IG(ON) dIFG/dt dIGQ/dt Parameter +5V PSU current +15V PSU current -15V PSU current +5V PSU minimum +15V PSU minimum -15V PSU minimum Peak forward gate current On-state gate current Rate of rise of positive gate current Rate of rise of negative gate current Conditions 500Hz, 50% duty cycle 500Hz 500Hz, IT = 3000A GTO Tj= 125C Min. Typ. Max. 4.40 0.48 10.0 Units A A A V V V A A A/s A/s
3.8 14.0 14.0 40
8 40 40
Measured 10 - 75% IFGM IT = 3000A, 90% IG(ON) - 50% IGQM
-
-
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GDU 90 20301
TIMING CHARACTERISTICS
Symbol t1* t2 t3* t4 t5* t6 t7 t8* t9 t10 t11 t12 Parameter No response pulse width of input signal Delay time emitter current to receiver o/p Turn-on delay emitter current to 10% IFGM IFGM pulse width Minimum on time 10% IFGM to 90% IG(ON) Receiver storage time Turn-off delay. Emitter current to 90% IG(ON) Minimum off time 90% IG(ON) to 10% IFGM Delay time Gate volts to o/p emitter current Turn-off delay Gate volts to test receiver o/p Storage time Gate volts to o/p emitter current Turn-on delay Gate volts to test receiver o/p
Conditions Adjustable by R81 + R82
Min. 2 0.2 5.0
Typ.
Max. 3 0.4 5.8
Units s s s s s s s s s s s s
16
Adjustable by R37
80 0.8 1.5 80
110 1.2 2.3 110
0.2 0.8 0.11 0.31
Adjustable by R38
Measured at low IGQM Measured at low IGQM
-
-
* t1,t3,t5,t8 are factory settings.
Adjustment of t1 alters t3
1. Varies with IGQM due to gate lead impedance.
Test circuit emitter current Control card receiver output IFGM Gate Drive Unit Waveforms
t1 t2 t6 10s dIFG/dt t3 t7 10% t4 t5 Min. ON time dIGQ/dt t8 0V Min. OFF -8V t9 t10 t11 t12 -8V 90% IG(ON) QGQT IGQM
Gate current
Gate voltage Control card emitter current
Test circuit receiver output
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GDU 90 20301
OUTLINE
Clearance underneath P.C.B. for mounting nuts etc. 5 13
0V V3 V2 V1
10
I/P Fibre optics O/P
200 centres 220
Gate
Cathode
4 holes O4.4 60 253 centres 279 Weight: 1.95Kg
All dimensions in mm, unless stated otherwise. DO NOT SCALE.
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GDU 90 20301
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of `T' 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS4562-5 Issue No. 5.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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